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Patent drawing for Camera module manufacturing method and camera module
US 8,313,971 B2
Optics US 8,313,971 B2 Expired

Camera module manufacturing method and camera module

This invention describes a method for manufacturing compact camera modules, such as those found in smartphones. It integrates light control directly into the lens structure by forming a light-blocking layer on the sides of the lenses and their support components. This layer acts as both a diaphragm to regulate incoming light and a shield against stray light, eliminating the need for separate parts and simplifying the module. The method involves preparing image sensor wafers and lens arrays.

Why it matters: Wafer-level optics manufacturing has matured significantly since 2008, making the precise, integrated light shielding described here more feasible and cost-effective for mass production of compact camera modules.

Status
ExpiredProtection ended and was never renewed
How hard to build
SpecializedWafer-level optics, micro-scale light shielding

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