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Patent drawing for Camera module and method for fabricating the same
US 8,251,601 B2
Electrical US 8,251,601 B2 Not in force

Camera module and method for fabricating the same

This is a compact camera module designed to prevent unwanted light from reaching the image sensor. It achieves this by placing an optical lens directly on an image sensor chip, then using a metal plate that extends beneath the chip. A metal coating surrounds the sides of the lens and the top of the metal plate, with an additional light-blocking layer covering the sides of this metal coating. The claims specifically describe versions that include an insulating layer and/or a second light-blocking layer between the chip and the metal coating.

Why it matters: Filed before advanced micro-fabrication and packaging techniques for embedded camera modules were mature. The design's compact light shielding and integration could now be more efficiently realized, particularly for devices where space is at a premium.

Status
Not in forceListed as no longer active. The specific reason is not in the record we hold.
How hard to build
SpecializedMicro-assembly, custom silicon, specialized coatings

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