This invention describes a way to find hidden flaws, like cracks or voids, inside a material and measure their size. It works by sending a specific type of acoustic wave, called a lamb wave, into the material and then analyzing how that wave bounces off both the front and back edges of any anomaly it encounters. This analysis helps pinpoint the flaw's location, size, and shape.
Why it matters: The patent was filed before the widespread availability of high-performance computing and advanced machine learning techniques. These advancements now make the complex signal processing required to precisely measure anomaly size, location, and shape from scattered wave data significantly more efficient and accurate.
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