Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization

This describes a method for building tiny, intricate 3D objects by stacking many thin layers. It uses electroplating to deposit material, often incorporating insulating sheets, and then shapes each layer using masks. The masks can be transferred onto the surface or printed directly, for example, with an inkjet. The process specifically requires that at least one of the materials used in the structure is an insulating (dielectric) material.