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Patent drawing for Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
US 7,109,118 B2
Chemistry US 7,109,118 B2 Expired

Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures

This invention describes a way to build complex 3D objects by stacking many thin layers. Each layer involves creating a pattern with a conductive metal, then treating its surface to prevent other materials from sticking where they shouldn't, or to make them easier to clean off. The initial claims specifically detail using electroplating with a mask to form the patterned metal layers.

Why it matters: Filed before the widespread commercialization and sophistication of metal additive manufacturing. The techniques for precise layer control and preventing overplating, crucial for multi-material 3D structures, are now highly relevant for advanced additive manufacturing processes.

Status
ExpiredProtection ended and was never renewed
How hard to build
SpecializedElectroplating, masking, surface chemistry

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