This invention describes a tough, compact sensor designed to be buried with crops. Its smooth, rounded shape, like a short cylinder or an ellipsoid, allows it to stay with the crops from planting through harvesting, transport, and storage without getting snagged or damaged. It includes embedded electrical components that also do not protrude from its surface.
Why it matters: The short time since filing means fundamental technology hasn't shifted significantly. Challenges like long-term power supply and reliable wireless communication through soil likely remain significant obstacles.
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