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Patent drawing for Cluster processing system for forming a metal containing material
US 20,230,377,958 A1
Semiconductors US 20,230,377,958 A1 Not in force

Cluster processing system for forming a metal containing material

This invention describes a method for creating tiny components for semiconductor devices. It involves forming an extremely thin layer of a specific material, such as MoS2 or WS2, on a base, then heating that layer, and finally adding a protective top layer. All these steps are performed sequentially within a specialized processing system without ever exposing the material to air.

Why it matters: Continued advancements in atomic layer deposition and chemical vapor deposition for 2D materials, alongside improved in-situ process control within vacuum cluster systems, may now offer better prospects for achieving the required material quality and uniformity for semiconductor integration.

Status
Not in forceListed as no longer active. The specific reason is not in the record we hold.
How hard to build
SpecializedSpecialized vacuum cluster processing equipment

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