Additive manufacturing of polishing pads

This invention describes a way to make special polishing pads for manufacturing semiconductors. The pads are built using a 3D printing method from two different types of liquid plastic that, when hardened, form an interpenetrating polymer network—meaning their molecular structures intertwine. The specific type of free-radically polymerized material mentioned is a urethane acrylate oligomer, and the ratio of the two plastics is carefully chosen to control the pad's final properties like strength and flexibility.

Why it matters: Filed in 2023, the rapid advancements in multi-material additive manufacturing since then could make the precise control of IPN ratios and resulting pad properties more feasible or cost-effective.

Status: ExpiredProtection ended and was never renewed
How hard to build: SpecializedChemical formulation, additive manufacturing equipment

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