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Patent drawing for Wire bundle processing method
US 11,319,183 B2
Material handling US 11,319,183 B2 Not in force

Wire bundle processing method

This invention describes a way to prevent wires from getting tangled as they are fed into a processing machine. It uses a special tray surface that grips the bottom wire more tightly than the wires grip each other. When a second wire is moved across the first, the tray surface holds the bottom wire steady, preventing it from shifting and tangling. The special surface can be made from various materials like rubber, plastic, or fabric.

Why it matters: Since 2019, increased automation and higher processing speeds in wire manufacturing have made entanglement a more critical bottleneck. This passive friction-based method could offer a simpler, more robust solution for high-throughput automated wire handling compared to complex active systems.

Status
Not in forceListed as no longer active. The specific reason is not in the record we hold.
How hard to build
ModerateFriction-optimized tray surface material

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