Integrated circuit package substrate

This invention describes a manufacturing process for a specialized base, called a package substrate, used to connect computer chips. The process ensures that one side of the substrate, where lands are located, receives a specific outermost finish, while the opposite side, where chip connection pads are, receives a different outermost finish. This is achieved by carefully applying and removing protective layers during the finishing steps.

Why it matters: The period since 2019 has seen rapid advancements in advanced packaging for AI and high-performance computing. This method for precise dual-sided surface finishing could now be more critical for optimizing complex chip interconnects and thermal performance in these demanding applications.

Status: Not in forceListed as no longer active. The specific reason is not in the record we hold.
How hard to build: SpecializedMicrofabrication, chemical deposition, lamination

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