Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices

This invention describes a way to make three-dimensional electronic devices by building up a plastic structure layer-by-layer using a 3D printer that melts and deposits plastic, known as Fused Deposition Modeling (FDM). This plastic structure is designed with tiny holes and spaces. Once the structure is printed, conductive material is used to fill the holes, creating electrical connections, and electronic components are placed into the designated spaces.

Why it matters: Filed before multi-material FDM and integrated component placement were common. These technologies are now more accessible and precise, simplifying system integration.

Status: Not in forceListed as no longer active. The specific reason is not in the record we hold.
How hard to build: SpecializedMulti-material FDM, component pick-and-place

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