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This invention describes a way to build quantum computers using multiple specialized chips, called dies, mounted on a base. These chips are connected to each other sideways using special wires made of superconducting material. At least one of these chips performs the actual quantum calculations. The claims specify a particular physical arrangement for how these chips are mounted and connected.
Why it matters: Since 2018, the quantum computing field has seen rapid progress in qubit development, making the challenge of scaling and interconnecting multiple quantum processing units more urgent. Advances in superconducting materials and advanced packaging techniques could now make this specific multi-die, superconducting interconnect architecture more viable for building larger, more powerful quantum computers.
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