This invention describes a way to cool electronic devices by placing them inside a sealed container filled with a special cooling liquid. This container is designed with two separate heat-removing components, called heat sinks, that are both in direct contact with the liquid. If one heat sink isn't enough or fails, the system can rely on the second one to continue removing heat from the device.
Why it matters: The power density of electronic components, especially for AI and high-performance computing, has dramatically increased since 2016, making multi-stage and redundant liquid cooling solutions like this more essential.
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